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A comprehensive guide to 3D IC integration and packaging technology
3D IC Integration and Packagingfully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.
3D IC Integration and Packagingcovers:
3D integration for semiconductor IC packaging
Through-silicon vias modeling and testing
Stress sensors for thin-wafer handling and strength measurement
Package substrate technologies
Microbump fabrication, assembly, andló7
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