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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies [Hardcover]

$141.99     $150.95    6% Off      (Free Shipping)
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  • Category: Books (Technology & Engineering)
  • ISBN-10:  1119314135
  • ISBN-10:  1119314135
  • ISBN-13:  9781119314134
  • ISBN-13:  9781119314134
  • Publisher:  Wiley-IEEE Press
  • Publisher:  Wiley-IEEE Press
  • Pages:  576
  • Pages:  576
  • Binding:  Hardcover
  • Binding:  Hardcover
  • Pub Date:  01-Apr-2019
  • Pub Date:  01-Apr-2019
  • SKU:  1119314135-11-MPOD
  • SKU:  1119314135-11-MPOD
  • Item ID: 103177287
  • List Price: $150.95
  • Seller: ShopSpell
  • Ships in: 2 business days
  • Transit time: Up to 5 business days
  • Delivery by: Apr 09 to Apr 11
  • Notes: Brand New Book. Order Now.
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