- This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
- Describes the processes available for creating integrated passives, measuring their properties, and applying them.
- Brings reader up to date in a fast-moving technology.
- Enables reader to implement the technology into a manufacturing environment.
- Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
- Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
Contributors.
Preface.
1 Introduction (Richard K. Ulrich).
1.1 Status and Trends in Discrete Passive Components.
1.2 Definitions and Configurations of Integrated Passives.
1.3 Comparison to Integrated Active Devices.
1.4 Substrates and Interconnect Systems for Integrated Passives.
1.5 Fabrication of Integrated Passives.
1.6 Reasons for Integrating Passive Devices.
1.7 Problems with Integrating Passive Devices.
1.8 Applications for Integrated Passives.
1.9 The Past and Future of Integrated Passives.
1.10 Organization of this Book.
References.
2 Characteristics and Performance of Planar Resistors (Richard K. Ulrich).
2.1 Performance Parameters.
2.2 Resistance in Electronic Materials.
2.3 Sizing Integrated Resistors.
2.4 Trimming.
References.
3 Integrated Resistor Materials and Processes (Richard K. UlrilC;