Advances in Cryogenic Engineering Materials [Paperback]

The Sixth International Cryogenic Materials Conference (ICMC) was held on the campus of Massachusetts Institute of Technology in Cambridge in col? laboration with the Cryogenic Engineering Conference (CEC) on August 12-16, 1985. The complementary program and the interdependence of these two dis? ciplines foster the conference. Its manifest purpose is sharing the latest advances in low temperature materials science and technology. Equally im? portant, areas of needed research are identified, prioriti-es for new research are set, and an increased appreciation of interdisciplinary, interlaboratory, and international cooperation ensues. The success of the conference is the result of the. able leadership and hard work of many people: S. Foner of M.I.T. coordinated ICMC efforts as its Conference Chairman. A. I. Braginski of Westinghouse R&D Center planned the program with the assistance of Cochairmen E. N. C. Dalder of Lawrence Livermore National Laboratory, T. P. Orlando of M.I.T., D. O. Welch of Brookhaven National Laboratory, and numerous other committee members. A. M. Dawson of M.I.T., Chairman of Local Arrangements, and G. M. Fitzgerald, Chairman of Special Events, skillfully managed the joint conference. The contributions of the CEC Board, and particularly its conference chairman, J. L. Smith, Jr. of M.I.T., to the organization of the joint conference are also gratefully acknm.ledged.The Sixth International Cryogenic Materials Conference (ICMC) was held on the campus of Massachusetts Institute of Technology in Cambridge in col? laboration with the Cryogenic Engineering Conference (CEC) on August 12-16, 1985. The complementary program and the interdependence of these two dis? ciplines foster the conference. Its manifest purpose is sharing the latest advances in low temperature materials science and technology. Equally im? portant, areas of needed research are identified, prioriti-es for new research are set, and an increased appreciation of interdisciplinary, intl.