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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore [Paperback]

$267.99       (Free Shipping)
74 available
  • Category: Books (Technology & Engineering)
  • Author:  Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao
  • Author:  Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao
  • ISBN-10:  0081025327
  • ISBN-10:  0081025327
  • ISBN-13:  9780081025321
  • ISBN-13:  9780081025321
  • Publisher:  Woodhead Publishing
  • Publisher:  Woodhead Publishing
  • Pages:  434
  • Pages:  434
  • Binding:  Paperback
  • Binding:  Paperback
  • Pub Date:  01-Jun-2019
  • Pub Date:  01-Jun-2019
  • SKU:  0081025327-11-MPOD
  • SKU:  0081025327-11-MPOD
  • Item ID: 104164948
  • Seller: ShopSpell
  • Ships in: 2 business days
  • Transit time: Up to 5 business days
  • Delivery by: Dec 27 to Dec 29
  • Notes: Brand New Book. Order Now.
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